Circuits, devices and methods for programming a fuse

ABSTRACT

Fuse programming circuits, devices and methods. In some embodiments, a fuse circuit can include a fuse pad configured to receive a voltage, a fuse having a first end coupled to the fuse pad and a second end coupled to a switching element configured to enable a current to pass from the fuse pad to a ground potential.

CROSS-REFERENCE TO RELATED APPLICATION(S)

This application claims priority to U.S. Provisional Application No.62/533,881 filed Jul. 18, 2017, entitled PSEUDO FUSE PAD, the disclosureof which is hereby expressly incorporated by reference herein in itsrespective entirety.

BACKGROUND Field

The present disclosure relates to fuse state programming and sensingtechnology implemented in semiconductor devices.

Description of the Related Art

In many integrated circuits implemented on semiconductor devices such asdie, fuses can be utilized to store information. For example,fuse-stored values can provide information about part-to-part and/orprocess variations among different integrated circuit die. With suchinformation, a given integrated circuit die can be operatedappropriately to provide desired functionality.

SUMMARY

In accordance with some implementations, the present disclosure relatesto a fuse circuit that includes a fuse pad configured to receive avoltage, a fuse having a first end and a second end, the first endcoupled to the fuse pad and a switching element coupled to the secondend of the fuse and configured to enable a current to pass from the fusepad to a ground potential.

In some embodiments, the fuse circuit further comprises a fuse statesensing circuit coupled to the second end of the fuse. In someembodiments, the fuse state sensing circuit is configured to be coupledto a plurality of fuse circuits. In some embodiments, the fuse statesensing circuit is dedicated to only be coupled to the fuse circuit.

In some embodiments, the switching element is a voltage-controlledswitching element. In some embodiments, the voltage-controlled switchingelement is coupled to a fuse program control signal.

In some embodiments, the switching element is configured to be closedduring a programming operational mode of the fuse. In some embodiments,the fuse pad receives a programming voltage during a programmingoperational mode of the fuse.

In some embodiments, the switching element is configured to be openduring a sensing operational mode of the fuse. In some embodiments, thefuse pad is coupled to a ground potential during a sensing operationalmode of the fuse.

In some embodiments, the fuse circuit is implemented on a semiconductordie. In some embodiments, the switching element is metal oxide fieldeffect transistor.

According to some teachings, the present disclosure relates to a methodfor programming a state of a fuse element. The method includes providinga fuse pad coupled to a first end of a fuse, a switching element coupledto a second end of the fuse, and a fuse state sensing circuit coupled tothe second end. The method may further include closing the switchingelement, applying a voltage at the fuse pad so that a programmingcurrent flows through the fuse, opening the switching element andcoupling the fuse pad to a ground potential.

In some embodiments, closing the switching element comprises applying afuse program control signal to the switching element. In someembodiments, opening the switching element comprises ceasing to apply afuse program control signal to the switching element. The method mayfurther include, applying a sense current to the second end of the fusefrom the fuse state sensing circuit. In some embodiments the methodincludes sensing a state of the fuse based on a voltage drop detectedand measured by the fuse state sensing circuit across the fuse.

In some implementations, the present disclosure relates to a wirelessdevice that includes an antenna configured to at least receive aradio-frequency signal, and a receive module configured receive andprocess the radio-frequency signal. The receive module has asemiconductor die that includes an integrated circuit. The receivemodule further includes a fuse circuit including a fuse pad configuredto receive a voltage, a fuse having a first end coupled to the fuse padand a second end coupled to a switching element configured to enable acurrent to pass from the fuse pad to a ground potential and a fuse statesensing circuit.

In some embodiments, the antenna is a diversity antenna. In someembodiments, the wireless device is a cellular device.

For purposes of summarizing the disclosure, certain aspects, advantagesand novel features of the inventions have been described herein. It isto be understood that not necessarily all such advantages may beachieved in accordance with any particular embodiment of the invention.Thus, the invention may be embodied or carried out in a manner thatachieves or optimizes one advantage or group of advantages as taughtherein without necessarily achieving other advantages as may be taughtor suggested herein.

BRIEF DESCRIPTION OF THE DRAWINGS

FIG. 1A shows a fuse system that includes a fuse pad, in accordance withsome implementations.

FIG. 1B shows a fuse system that includes a fuse pad, in accordance withsome implementations.

FIG. 2A shows a fuse system that includes a fuse pad having one or morefeatures as described herein.

FIG. 2B shows a fuse system that includes a fuse pad having one or morefeatures as described herein.

FIG. 3 shows a fuse system that includes a dynamic fuse sensing andlatch circuit having one or more features as described herein.

FIG. 4 depicts an example wireless device having one or moreadvantageous features described herein.

DETAILED DESCRIPTION OF SOME EMBODIMENTS

The headings provided herein, if any, are for convenience only and donot necessarily affect the scope or meaning of the claimed invention.

In many integrated circuit devices, fuses are widely utilized to storevalues to provide useful information. For example, fuse-stored valuescan provide information about part-to-part and/or process variationsamong different devices such as integrated circuit die. With suchinformation, a given integrated circuit die can be operatedappropriately to provide improved or desired performance. In anotherexample, fuse-stored values can be utilized as unique codes to provide,for example, security functionality.

In some embodiments, an integrated circuit implementing a fuse pad toprogram a fuse has limited space for pads or contacts dedicated to sucha limited functionality. Additionally, this would limit the availablespace for an additional pad for sensing the state of a respective fuse.Existing programmable fuses may require two pads or contacts for arespective fuse circuit, to program the fuse and to sense it,respectively. An integrated circuit die can include multiple fuses(e.g., greater than 50). Thus, it is desirable to have a fuseprogramming and sensing circuit be relatively compact to allow thecorresponding die to also be more compact. It is also desirable to havea fuse programming and sensing circuit have smaller transient currentconsumption to allow the corresponding die to be more power efficient.

FIG. 1A shows a fuse system 100 (or fuse circuit) that includes a fusepad 102, in accordance with some implementations. The fuse system 100shown in FIG. 1A includes a fuse pad 102 configured to receive a voltage(e.g., a programming voltage) and/or a fusing supply current to passthrough a fuse 106. Fuse 106 may have a first end coupled to fuse pad102, and a second end coupled to switching element 108. In someembodiments, switching element 108 is a transistor, and in someembodiments, it is a metal oxide semiconductor field effect transistor(MOSFET). Switching element 108 may be controlled or operable by a fuseprogram control signal 110. For example, if switching element 108 is avoltage controlled switching element such as a MOSFET, as shown, fuseprogram control signal 110 may be a voltage applied to the gate ofswitching element 108 to close the switch. In some embodiments, to openswitching element 108 (e.g., from a closed state), fuse program controlsignal 110 ceases to be applied.

FIG. 1A illustrates a conventional approach to programming a fuse 106,using an application of a fusing current or voltage applied to fuse pad102, while a switching element 108 is closed (e.g., a fuse programcontrol signal/voltage is applied to switching element 108). In someembodiments switching element 108 is substantially simultaneously closedwhile the fusing current and/or voltage is applied to fuse pad 102. Ascan be seen in FIG. 1A, when switching element 108 is closed, aprogramming current (e.g., shown as having a voltage V_(FusE) across thefuse), has a path to ground, and can therefore alter a physical state ofthe fuse. This alteration of a physical state of the fuse may bereferred to as programming or “blowing” the fuse. During thisprogramming operational mode of the fuse, a sense circuit coupled tosense signal line 104 (e.g., coupled to the first end of fuse 106) maybe used to determine if the fuse has been successfully programmed ornot. In the example of FIG. 1A, in some embodiments, a dedicated padwould be required to provide a source for the fuse program controlsignal/voltage 110 used to control operation of the switching element108.

FIG. 1B shows a fuse system 100 that includes a fuse pad 102, inaccordance with some implementations. In FIG. 1B, fuse pad 102 is nolonger having a fusing current and/or voltage applied to it, forpurposes of programming or blowing fuse 106. FIG. 1B illustrates asensing operational mode of the fuse, where the voltage drop across fuse106 is being determined by a sensing circuit on signal line 104. In thisconventional approach, the sensing circuit signal line 104 is coupled tothe first end (e.g., the end coupled to fuse pad 102), of fuse 106. Inorder to sense the state of fuse 106 (e.g., blown or intact), thesensing circuit needs to pass a sensing current through fuse 106. Inorder to do this, a voltage must be applied (e.g., fuse program controlsignal/voltage 110) to switching element 108 to close it, and allow thesensing current to flow through fuse 106 to ground. In order forswitching element 108 to be closed by application of a voltage, fuseprogram control signal line 110 must be coupled to another pad, distinctfrom fuse pad 102. This adds to the complexity and area requirements ofan integrated circuit implementing fuse circuit 100.

FIG. 2A shows another fuse system 200 (or fuse circuit) that includes afuse pad 102, having one or more features as described herein. Unlike infuse system 100 of FIGS. 1A and 1B, sensing circuit signal line 104 iscoupled to the second end of fuse 106. FIG. 2A illustrates a referencenode 112 where the second end of fuse 106, sensing circuit signal line104 and a drain terminal of switching element 108 (e.g., depicted as athree-terminal device) are all coupled.

Similar to fuse system 100, programming fuse 106 includes applying afusing current and/or voltage to fuse pad 102, and closing switchingelement 108 in order to allow a programming current to pass through fuse106 to the ground potential coupled to a source terminal of switchingelement 108.

FIG. 2B shows a fuse system 200 that includes a fuse pad 102 having oneor more features as described herein. In FIG. 2B, rather than remainingunused and floating, fuse pad 102 is hard-wired, or coupled to a groundpotential. As a result, in order for a sensing circuit coupled toreference node 112 (e.g., the second end of fuse 106) to read a voltageacross fuse 106, a sensing current can be generated by the sensingcircuit, passed over signal line 104 and through fuse 106 to thegrounded fuse pad 102.

This arrangement shown in FIG. 2B does not require activation ofswitching element 108 during a sensing operational mode of the fusecircuit. As a result, both fuse pad 102 and switching element 108require application of a voltage during a programming operational modeof fuse 106, and neither fuse pad 102 nor switching element 108 requireapplication of a voltage during a sensing operational mode of fuse 106.As such, a source of the fuse program control signal 110 may be derivedfrom fuse pad 102, eliminating the need for an additional pad to supplyvoltage for fuse program control line 110 coupled to switching element108.

In some implementations, a method is provided for programming a state ofa fuse element. The method may include providing a fuse pad coupled to afirst end of a fuse, a switching element coupled to a second end of thefuse, and a fuse state sensing circuit coupled to the second end. Forexample, as shown in FIG. 2A, fuse pad 102 is coupled to a first end offuse 106, and switching element 108 is coupled to the second end of fuse106, along with a sensing circuit. The method may include closing theswitching element (e.g., switching element 108 of FIG. 2A). In someembodiments, the method includes applying a voltage at the fuse pad sothat a programming current flows through the fuse. For example, as shownin FIG. 2A, a voltage is applied to fuse pad 102, resulting in a currentflowing through fuse 106. The method may include opening the switchingelement (e.g., opening MOSFET 108 in FIG. 2A) and coupling the fuse padto a ground potential (e.g., as shown in FIG. 2B).

In some embodiments, closing the switching element comprises applying afuse program control signal to the switching element (e.g., applying avoltage on line 110 of switching element 108). In some embodiments,opening the switching element comprises ceasing to apply a fuse programcontrol signal to the switching element (e.g., discontinuing applicationof a voltage on line 110 of switching element 108).

In some embodiments, the method includes applying a sense current to thesecond end of the fuse from the fuse state sensing circuit. In someembodiments, the method includes sensing a state of the fuse based on avoltage drop detected and measured by the fuse state sensing circuitacross the fuse.

FIG. 3 illustrates an example schematic of a dynamic fuse sensing andlatch circuit 300 which may be coupled to a fuse pad 102 and fuse 106 asdescribed herein. One of ordinary skill in the art will understand thatalternate implementations of the dynamic fuse sensing and latch circuit300 are possible.

In the embodiment illustrated in FIG. 3, the fuse sensing circuit 10includes a first controlled current source 308 and a second controlledcurrent source 310. The first controlled current source 308 may includea P-type Metal Oxide Semiconductor Field Effect Transistor (MOSFET) 316a, a P-type MOSFET 318 a, an N-type MOSFET 320 a and an N-type MOSFET322 a. The second controlled current source 310 is formed similarly andincludes a P-type MOSFET 316 b, a P-type MOSFET 318 b, an N-type MOSFET320 b, and an N-type MOSFET 322 b. The latch circuit 20 may include afirst NAND gate 326 and a second NAND gate 328.

The MOSFET 316 a includes a source configured to be connected to avoltage source 330, a gate connected to the sense enable input 306, anda drain connected to a drain of the MOSFET 318 a, a drain of the MOSFET320 a, a gate of the MOSFET 318 b, a gate of the MOSFET 320 b, and afirst input of the second NAND gate 328. The MOSFET 318 a includes asource configured to be connected to the voltage source 330, a gateconnected to a gate of the MOSFET 320 a, a first input of the first NANDgate 326, a drain of the MOSFET 316 b, a drain of the MOSFET 320 a, thedrain of the MOSFET 316 a, the first input of the second NAND gate 328,the gate of the MOSFET 318 b, and the gate of the MOSFET 320 b.

The drain of the MOSFET 320 a is connected to the drain of the MOSFET316 a, the drain of the MOSFET 318 a, the first input of the second NANDgate 328, the gate of the MOSFET 318 b, and the gate of the MOSFET 320b. The gate of MOSFET 320 a is connected to the gate of the MOSFET 318a, the first input of the first NAND gate 326, the drain of the MOSFET316 b, the drain of the MOSFET 318 b, and the drain of the MOSFET 320 b,and the source of the MOSFET 320 a is connected to a drain of the MOSFET322 a. The drain of the MOSFET 322 a is connected to the source of theMOSFET 320 a, the gate is connected to the sense enable input 306, andthe source is connected to a first contact of the fuse 106. A secondcontact of the fuse 106 is connected to a reference potential node(e.g., a ground node), and the fuse 106 is further coupled to the fusecontrol circuit 304.

The MOSFET 316 b includes a source configured to be connected to thevoltage source 330, a gate connected to the sense enable input 306, anda drain connected to the drain of the MOSFET 318 b, the drain of theMOSFET 320 b, the gates of the MOSFETs 318 a and 320 a, and the firstinput of the first NAND gate 326. MOSFET 388 b includes a sourceconfigured to be connected to the voltage source 330, a gate connectedto the gate of the MOSFET 320 b, the drains of the MOSFETs 316 a and 318a, the drain of the MOSFET 320 a, and the first input of the second NANDgate 328, and a drain connected to the drain of the MOSFET 316 b, thedrain of the MOSFET 320 b, the gates of the MOSFETs 318 a and 320 a, andthe first input of the first NAND gate 326.

The MOSFET 320 b includes a drain connected to the drain of the MOSFET316 b, the drain of the MOSFET 318 b, the gates of the MOSFETs 318 a and320 a, and the first input of the first NAND gate 326, a gate connectedto the gate of the MOSFET 318 b, the drains of the MOSFETs 316 a and 318a, the drain of the MOSFET 320 a, and the first input of the second NANDgate 328, and a source connected to a drain of the MOSFET 322 b. TheMOSFET 322 b includes a drain connected to the source of the MOSFET 320b, a gate connected to the sense enable input 306, and a sourceconnected to a first contact of the resistor 324. A second contact ofthe resistor 324 is connected to a reference potential node (e.g., aground node).

In some embodiments, fuse control circuit 304 is configured to program astate (e.g., blown or intact) of fuse 106 by altering the resistance offuse 106. For example, an intact fuse may have a resistance ofapproximately 200 Ohms, while a blown fuse may have a resistance ofapproximately 2000 Ohms (i.e., a magnitude higher). In accordance withaspects of the present disclosure, in a blown state, fuse 106 remainsphysically intact, but the structure of fuse 106 is changed sufficientlyto alter a resistance value of the fuse 106. In some embodiments, fusecontrol circuit 304 is implemented in fuse pad 102, while in someembodiments, fuse control circuit 304 is a distinct circuit from fusepad 102. FIG. 3 illustrates a sensing circuit 10 implemented at a firstend of fuse 106, as shown in FIG. 1A. However, one of ordinary skill inthe art will understand that sensing circuit 10 may be implemented at asecond end of fuse 106 as shown in FIG. 2A. Additionally, FIG. 3 doesnot illustrate implementation of switching element 108, between a secondend of fuse 106 and ground, however one of ordinary skill in the artwill understand that this could be implemented as shown in FIGS. 1A-2B.

FIG. 3 shows an example embodiment of a fuse sensing circuit 10 coupledto a fuse 106. For the purpose of description, it will be understoodthat such a fuse may be implemented on a semiconductor die andconfigured to be in a first state (e.g., intact state) or a second state(e.g., blown state). In some embodiments, some or all of a fuse system300 having one or more features as described herein can be implementedon a semiconductor die. Such a semiconductor die can also include anintegrated circuit that utilizes the fuse system 300. In someembodiments, a fuse 106 associated with the fuse system 300 can beformed as part of the die, and substantially all of a fuse sensingcircuit 10 of the fuse system 300 can also be implemented on the die.

In some embodiments, a radio-frequency (RF) system can include a fusesystem 200 having one or more features as described herein. Such a fusesystem 200 can be utilized for initializing and/or resetting one or moreintegrated circuits, including one or more RF circuits. Such an RFsystem can be configured to receive a signal such as a Vio signal by acontrol system such as a MIPI (Mobile Industry Processor Interface)controller and a POR circuit. The POR circuit can generate a POR signaland related signal(s) such as a POR signal, and provide such signals tothe MIPI controller as well as the fuse system 200. Based on suchsignals, the fuse system 200 can determine the states of various fusesassociated with the one or more RF circuits, and provide such fusestates to the MIPI controller. Based on such fuse states, the MIPIcontroller can generate control signals to initialize and/or reset theone or more RF circuits.

In some embodiments, a fuse system 200 having one or more features asdescribed herein can be implemented in an electronic module. Such amodule can include a packaging substrate configured to receive aplurality of components, including one or more semiconductor die havingintegrated circuits. As described herein, such semiconductor die caninclude a number of fuses with different states. Thus, the fuse system200 can program and sense such fuse states as described herein, andprovide such information to a control system. The control system cangenerate control signals based on such fuse states, and such controlsignals can be utilized to initialize and/or reset one or moreintegrated circuits in the one or more semiconductor die.

In some embodiments, a fuse system 200 having one or more features asdescribed herein can be implemented in an RF module. Such a module caninclude a packaging substrate configured to receive a plurality ofcomponents, including one or more semiconductor die having RF circuits.As described herein, such semiconductor die can include a number offuses with different states. Thus, the fuse system 200 can program andsense such fuse states as described herein, and provide such informationto a controller such as a MIPI controller. The controller can generatecontrol signals based on such fuse states, and such control signals canbe utilized to initialize and/or reset one or more RF circuits in theone or more semiconductor die.

In some embodiments, an RF module can be implemented as a front-endmodule (FEM). Such a module can include a one or more semiconductor diehaving RF circuits associated with a front-end (FE) architecture. Asdescribed herein, such semiconductor die can include a number of fuseswith different states. Thus, the fuse system 200 can program and sensesuch fuse states as described herein, and provide such information to acontroller such as a MIPI controller. Such a controller can generatecontrol signals based on such fuse states, and such control signals canbe utilized to initialize and/or reset one or more RF circuitsassociated with the front-end architecture.

In some embodiments, an RF module can be implemented as a poweramplifier module (PAM). Such a module can include one or moresemiconductor die having RF circuits associated with power amplifier(s)and related circuits. As described herein, such semiconductor die caninclude a number of fuses with different states. Thus, the fuse system200 can program and sense such fuse states as described herein, andprovide such information to a controller such as a MIPI controller. Sucha controller can generate control signals based on such fuse states, andsuch control signals can be utilized to initialize and/or reset one ormore RF circuits associated with the power amplifier(s) and relatedcircuits.

In some embodiments, an RF module can be implemented as a switch module(e.g., an antenna switch module (ASM)). Such a module can include one ormore semiconductor die having RF circuits associated with switches andrelated circuits. As described herein, such semiconductor die caninclude a number of fuses with different states. Thus, the fuse system200 can program and sense such fuse states as described herein, andprovide such information to a controller such as a MIPI controller. Sucha controller can generate control signals based on such fuse states, andsuch control signals can be utilized to initialize and/or reset one ormore RF circuits associated with the switches and related circuits.

In some embodiments, an RF module can be implemented as a diversityreceive (DRx) module. Such a module can include one or moresemiconductor die having RF circuits associated with low-noiseamplifiers (LNAs), switches, etc., and related circuits. As describedherein, such semiconductor die can include a number of fuses withdifferent states. Thus, the fuse system 200 can sense such fuse statesas described herein, and provide such information to a controller suchas a MIPI controller. The controller can generate control signals basedon such fuse states, and such control signals can be utilized toinitialize and/or reset one or more RF circuits associated with theLNAs, switches, etc., and related circuits.

In some implementations, an architecture, device and/or circuit havingone or more features described herein can be included in an RF devicesuch as a wireless device. Such an architecture, device and/or circuitcan be implemented directly in the wireless device, in one or moremodular forms as described herein, or in some combination thereof. Insome embodiments, such a wireless device can include, for example, acellular phone, a smart-phone, a hand-held wireless device with orwithout phone functionality, a wireless tablet, a wireless router, awireless access point, a wireless base station, etc. Although describedin the context of wireless devices, it will be understood that one ormore features of the present disclosure can also be implemented in otherRF systems such as base stations.

FIG. 4 depicts an example wireless device 1400 having one or moreadvantageous features described herein. In some embodiments, a fusesystem having one or more features as described herein can beimplemented in a number of places in such a wireless device. Forexample, in some embodiments, such advantageous features can beimplemented in a module such as a front-end module 510 a, a poweramplifier module 510 b, a switch module 510 c, a diversity receivemodule 510 d, and/or a diversity RF module 510 e.

In the example of FIG. 4, power amplifiers (PAs) 1420 can receive theirrespective RF signals from a transceiver 1410 that can be configured andoperated to generate RF signals to be amplified and transmitted, and toprocess received signals. The transceiver 1410 is shown to interact witha baseband sub-system 1408 that is configured to provide conversionbetween data and/or voice signals suitable for a user and RF signalssuitable for the transceiver 1410. The transceiver 1410 is also shown tobe connected to a power management component 1406 that is configured tomanage power for the operation of the wireless device 1400. Such powermanagement can also control operations of the baseband sub-system 1408and other components of the wireless device 1400.

The baseband sub-system 1408 is shown to be connected to a userinterface 1402 to facilitate various input and output of voice and/ordata provided to and received from the user. The baseband sub-system1408 can also be connected to a memory 1404 that is configured to storedata and/or instructions to facilitate the operation of the wirelessdevice, and/or to provide storage of information for the user.

In the example of FIG. 4, the diversity receive module 510 d can beimplemented relatively close to one or more diversity antennas (e.g.,diversity antenna 1426). Such a configuration can allow an RF signalreceived through the diversity antenna 1426 to be processed (in someembodiments, including amplification by an LNA) with little or no lossof and/or little or no addition of noise to the RF signal from thediversity antenna 1426. Such processed signal from the diversity receivemodule 510 d can then be routed to the diversity RF module 510 e throughone or more signal paths (e.g., through a lossy line 1435).

In the example of FIG. 4, a main antenna 1416 can be configured to, forexample, facilitate transmission of RF signals from the PAs 1420. Suchamplified RF signals from the PAs 1420 can be routed to the antenna 1416through respective matching networks 1422, duplexers 1424, and amantenna switch 1414. In some embodiments, receive operations can also beachieved through the main antenna. Signals associated with such receiveoperations can be routed to a receiver circuit through the antennaswitch 1414 and the respective duplexers 1424.

A number of other wireless device configurations can utilize one or morefeatures described herein. For example, a wireless device does not needto be a multi-band device. In another example, a wireless device caninclude additional antennas such as diversity antenna, and additionalconnectivity features such as Wi-Fi, Bluetooth, and GPS.

Unless the context clearly requires otherwise, throughout thedescription and the claims, the words “comprise,” “comprising,” and thelike are to be construed in an inclusive sense, as opposed to anexclusive or exhaustive sense; that is to say, in the sense of“including, but not limited to.” The word “coupled”, as generally usedherein, refers to two or more elements that may be either directlyconnected, or connected by way of one or more intermediate elements.Additionally, the words “herein,” “above,” “below,” and words of similarimport, when used in this application, shall refer to this applicationas a whole and not to any particular portions of this application. Wherethe context permits, words in the above Detailed Description using thesingular or plural number may also include the plural or singular numberrespectively. The word “or” in reference to a list of two or more items,that word covers all of the following interpretations of the word: anyof the items in the list, all of the items in the list, and anycombination of the items in the list.

The above detailed description of embodiments of the invention is notintended to be exhaustive or to limit the invention to the precise formdisclosed above. While specific embodiments of, and examples for, theinvention are described above for illustrative purposes, variousequivalent modifications are possible within the scope of the invention,as those skilled in the relevant art will recognize. For example, whileprocesses or blocks are presented in a given order, alternativeembodiments may perform routines having steps, or employ systems havingblocks, in a different order, and some processes or blocks may bedeleted, moved, added, subdivided, combined, and/or modified. Each ofthese processes or blocks may be implemented in a variety of differentways. Also, while processes or blocks are at times shown as beingperformed in series, these processes or blocks may instead be performedin parallel, or may be performed at different times.

The teachings of the invention provided herein can be applied to othersystems, not necessarily the system described above. The elements andacts of the various embodiments described above can be combined toprovide further embodiments.

While some embodiments of the inventions have been described, theseembodiments have been presented by way of example only, and are notintended to limit the scope of the disclosure. Indeed, the novel methodsand systems described herein may be embodied in a variety of otherforms; furthermore, various omissions, substitutions and changes in theform of the methods and systems described herein may be made withoutdeparting from the spirit of the disclosure. The accompanying claims andtheir equivalents are intended to cover such forms or modifications aswould fall within the scope and spirit of the disclosure.

What is claimed is:
 1. A fuse circuit comprising: a fuse pad configuredto receive a voltage; a fuse having a first end and a second end, thefirst end coupled to the fuse pad; a switching element coupled to thesecond end of the fuse and configured to enable a current to pass fromthe fuse pad to a ground potential; and a fuse state sensing circuitcoupled to the second end of the fuse and configured to apply a sensecurrent to the second end of the fuse so that the sense current flowsthrough the fuse to the fuse pad.
 2. The fuse circuit of claim 1 whereinthe fuse state sensing circuit is configured to be coupled to aplurality of fuse circuits.
 3. The fuse circuit of claim 1 wherein thefuse state sensing circuit is dedicated to only be coupled to the fusecircuit.
 4. The fuse circuit of claim 1 wherein the switching element isa voltage-controlled switching element.
 5. The fuse circuit of claim 4wherein the voltage-controlled switching element is coupled to a fuseprogram control signal.
 6. The fuse circuit of claim 1 wherein theswitching element is configured to be closed during a programmingoperational mode of the fuse.
 7. The fuse circuit of claim 6 wherein thefuse pad receives a programming voltage during the programmingoperational mode of the fuse.
 8. The fuse circuit of claim 1 wherein theswitching element is configured to be open during a sensing operationalmode of the fuse.
 9. The fuse circuit of claim 8 wherein the fuse pad iscoupled to another ground potential during the sensing operational modeof the fuse.
 10. The fuse circuit of claim 1 wherein the fuse circuit isimplemented on a semiconductor die.
 11. The fuse circuit of claim 1wherein the switching element is a metal oxide field effect transistor.12. A method for programming a state of a fuse element, the methodcomprising: providing a fuse pad coupled to a first end of a fuse, aswitching element coupled to a second end of the fuse, and a fuse statesensing circuit coupled to the second end of the fuse; closing theswitching element; applying a voltage at the fuse pad so that aprogramming current flows through the fuse; opening the switchingelement; coupling the fuse pad to a ground potential; and applying asense current to the second end of the fuse from the fuse state sensingcircuit so that the sense current flows through the fuse to the fusepad.
 13. The fuse circuit of claim 9 wherein the other ground potentialis the same as the ground potential.
 14. The fuse circuit of claim 9wherein the ground potential is different from the other groundpotential.
 15. The method of claim 12 wherein the closing the switchingelement includes applying a fuse program control signal to the switchingelement.
 16. The method of claim 12 wherein the opening the switchingelement includes ceasing to apply a fuse program control signal to theswitching element.
 17. The method of claim 12 further comprising sensinga state of the fuse based on a voltage drop detected and measured by thefuse state sensing circuit across the fuse.
 18. A wireless devicecomprising: an antenna configured to at least receive a radio-frequencysignal; and a receive module configured receive and process theradio-frequency signal, the receive module having a semiconductor diethat includes an integrated circuit, the receive module furtherincluding a fuse circuit including a fuse pad configured to receive avoltage, a fuse having a first end coupled to the fuse pad and a secondend coupled to a switching element configured to enable a current topass from the fuse pad to a ground potential and a fuse state sensingcircuit.
 19. The wireless device of claim 18 wherein the antenna is adiversity antenna.
 20. The wireless device of claim 18 wherein thewireless device is a cellular device.